Development and Performance Evaluation of Soy Adhesive
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Date
2018
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Publisher
Civil Engineering Department, University of Ilorin
Abstract
Presently, particleboards are mainly produced with wood particles andurea-formaldehyde (UF) resins. The emission of carcinogenic formaldehyde in theproduction and use of particleboard has generated an urgent need for development of a formaldehyde-free wood adhesive for particleboard production. The aim of this research is to develop and conduct performance evaluation of soy adhesive, a green alternative that is not harmful to human health (carcinogenic free). In this work, soy adhesive was produced from soya beans and applied as binder in the production of particle board from wood dust often considered as wastes. The adhesive was added to the wood dust at different mixing ratios (weight ratio) and sieve sizes. The composite produced were compacted by cold pressingand subsequently dried at room temperature and in the oven at temperature of 105oC. The particle boards produced were tested for the performance evaluation. Physical properties namely, density, water absorption (WA) and thickness swelling (TS), and mechanical properties including Modulus of Elasticity (MOE) and Modulus of Rupture (MOR) wereassessed as a function of mixing ratios according to the ASTM D-1037-99standard. The water absorption and TS were measured after 24 hours of soaking in water. It was observed that density decreased with increase in the proportion of the sawdustin theratio. Similarly, the MOE and MOR of the fabricated particle board decreased with increase in the amount of sawdust in the mix. However, the water absorption and TS increased with proportion of saw dustin the mixing ratio
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Keywords
Particle board, sawdust, soy adhesives, physical properties, mechanical properties
Citation
Abiodun, L. O., & Ahmed, I. I. (2018). Development and Performance Evaluation of Soy Adhesive. USEP: Journal of Research Information in Civil Engineering, 15 (1), 2106-2117.